On the chemical affinity tensor in chemo-mechanics of deformable solids

Author details
  • Institute for Problems in Mechanical Engineering of the Russian Academy of Sciences, Saint Petersburg, Russian Federation
  • Institute for Problems in Mechanical Engineering of the Russian Academy of Sciences, Saint Petersburg, Russian Federation

Abstract

In this paper, an expression of the chemical affinity tensor for chemical reactions in a deformable body is derived. The reaction between diffusing and deformable solid components is considered. The reaction product is also a deformable solid material. The reaction is accompanied by the transformation strain. For an open system "deformable and diffusing components" in which a chemical reaction is localized at the reaction front, for the case of finite deformations, the balances of mass, linear momentum, energy and the second law of thermodynamics in the form of the Clausius–Duhem inequality are written down. A parameter is introduced that characterizes the degree of participation in the reaction of the diffusing component located on different sides of the reaction front. As a result, an expression is derived for the entropy production due to a chemical reaction at the propagating reaction front. The corresponding expression for energy dissipation has the form of the product of the normal component of the tensor, which has the meaning of the chemical affinity tensor, by the reaction rate at the oriented area element of the front. The expression follows from the fundamental laws without using constituting equations of the reaction components. The chemical affinity tensor is equal to a linear combination of the chemical potential tensors of the of the solid components of the reaction, equal to the energy-momentum tensors of Eshelby divided by the density of the material, and the chemical potential of the diffusing component. The tensorial nature of the chemical affinity is explained by the fact that the reaction occurs not at a point in the deformable body, but on an oriented area element passing through the point, just as a traction in a non-hydrostatically stressed body determined by a stress tensor, acts at the area element, unlike pressure at a point in a hydrostatic case. From the point of view of the mechanics of configuration forces, the affinity tensor determines the configuration force driving the propagation of the reaction front. The consistency of the result is confirmed by the coincidence with the classical expression of scalar affinity in the case of a hydrostatically stressed body. The derived expression of the affinity tensor makes it possible to formulate a kinetic equation for the reaction in which the stress-strain state affects the reaction through affinity. This equation is the closing equation for the coupled problem "chemistry–diffusion–mechanics". The importance of the result is also due to promising use in modeling volumetric chemical reactions which occurs at the meso-level on propagating reaction fronts.

Keywords

chemo-mechanicschemical affinity tensorchemical potentialdeformable solidchemical reaction frontreaction ratediffusionthermodynamics of open systemsEshelby energy-momentum tensormechanics of configuration forcesfundamental lawsinterphase boundarystrain discontinuity surfacefinite deformations.

Bibliography

  1. 1.Stringer J. Stress generation and relief in growing oxide films // Corrosion Science, 1970, pp. 513-543. https://doi.org/10.1016/S0010-938X(70)80036-1 Scholar
  2. 2.Kao D., McVitie J., Nix W., Saraswat K. Two-dimensional thermal oxidation of silicon-I. Experiments // IEEE Trans. Electron Devices, vol. ED-34, pp. 1008-1017. https://doi.org/10.1109/T-ED.1987.23037 Scholar
  3. 3.Kao D., McVitie J., Nix W., Saraswat K. Two-dimensional thermal oxidation of silicon-II. Modeling stress effect in wet oxides. // IEEE Trans. Electron Devices, vol. ED-35, pp. 25-37. http://dx.doi.org/10.1109/16.2412 Scholar
  4. 4.Mihalyi A., Jacodcine R.J., Delph T.J. Stress effects in the oxidation of planar silicon substrates // Applied Physics Letters, vol. 74, pp. 1981-1983. https://doi.org/10.1063/1.123720 Scholar
  5. 5.Yen J.Y., Hwu J.G. Enhancement of silicon oxidation rate due to tensile mechanical stress // Applied Physics Letter, 2000, vol. 76, pp. 1834-1835. http://dx.doi.org/10.1063/1.126181 Scholar
  6. 6.Muhlstein C., Brown S., Ritchie R. High-cycle fatigue and durability of polycrystalline silicon thin films in ambient air // Sensors and Actuators, 2001, vol. A94, pp. 177-188. http://dx.doi.org/10.1557/PROC-657-EE5.8 Scholar
  7. 7.Muhlstein C., Ritchie R. High-cycle fatigue of micron-scale polycrystalline silicon films: fracture mechanics analyses of the role of the silica/silicon interface // Int. J. of Fract, 2003, vol. 119/120, pp. 449-474. http://dx.doi.org/10.1023/A:1024988031390 Scholar
  8. 8.Muhlstein C., Stach E., Ritchie R. A reaction-layer mechanism for the delayed failure of micron-scale polycrystalline silicon structural films subjected to high-cycle fatigue loading // Acta Materialia, 2002, vol. 50, pp. 3579-3595. https://doi.org/10.1016/S1359-6454(02)00158-1 Scholar
  9. 9.Böhme T., Müller W.H., Weinberg K. Numerical modeling of diffusion induced phase transformations in mechanically stressed lead-free alloys // Computational Materials Science, 2009, vol. 45, pp. 837-844. https://doi.org/10.1016/j.commatsci.2008.08.015 Scholar
  10. 10.Wang Y., Wang Y., Ma L., Han L., Guo F. Effect of Sn grain c-axis on Cu atomic motion in Cu reinforced composite solder joints under electromigration // Journal of Electronic Materials, 2020, vol. 49, pp. 2159-2163. http://dx.doi.org/10.1007/s11664-019-07897-x Scholar
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Article information

Published
17 December 2025
Issue date
17 December 2025
Issue
No. 5 (2025)
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